hey folks. i... i just had my first time. i liked it a lot. and i think i found my true love. bga packages are awesome and easy to solder and reball
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i desoldered this flash a while back to map out the testpoints (https://lab.whitequark.org/notes/2018-09-17/game-boy-advance-cartridge-smc805-2/ …) and i just reballed it and soldered it back and it worked basically the first time. (i had to heat it up the second time because my flux gel is a very gnarly, very not bga ooze)pic.twitter.com/qL3EGPBAGF
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Replying to @whitequark
Wow !!! You are my hero, I always hated doing those... super risk and not much confirmation technic, except power up nicely or smoke ...
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Replying to @FPiednoel
well unless you misalign it or mount it in a wrong direction the worst thing that can happen is an open ball, which shouldn't lead to smoke on any well-designed circuit...
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Replying to @whitequark
Well, you can push too hard on the top too , and get some short cuts ;-) the smaller the grid, the worse it gets.
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Replying to @FPiednoel
right, I haven't worked with any fine pitch bgas yet. that said i think you aren't supposed to push on the top? nudging it a bit to the side to see if the solder melted properly is good, but pushing on the top seems too much to me
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Replying to @whitequark
Yes, with hand, pushing is a bad idea, but with very large chips, the application tool will push, you are suppose to see the bubbles contract when melting and release stabilization when cooling, the hard part is to stabilize without pushing, while making contact.
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