you don't have solder balls you have solid solder plates. in theory. in practice you have fuck all working because there's a bubble somewhere and you still need an x-ray to even discover it but then you can't rework the goddamn thing anyway
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Relatively slow digital ICs are very hardy, analog parts can have parameter drift if overheated for _too_ long. Also I've seen at least one MEMS package pop, but there were extenuating circumstances. In general risk is low IMO.
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And this is why I probably need a hot air station, since I've had non-zero causalities with my FX888D (through no fault of the iron), and also because there's an awful lot of SMD parts/assemblies out there.
Thanks. Twitter will use this to make your timeline better. UndoUndo
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