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Nondestructive chip imaging by ptychographic X-ray laminography, no delayering required

spectrum.ieee.org

The X-Ray Tech That Reveals Chip Designs

When you’re baking a cake, it’s hard to know when the inside is in the state you want it to be. The same is true—with much higher stakes—for microelectronic chips: How can engineers confirm that...

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May 1

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@brouhaha

I never knew these metal wiring interconnects were hollow!

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I think what you're referring to is the PMD (pre-metal dielectric) between the die and second metal layer, and IMD (inter-metal dielectric) between the additional layers. These are usually phosphosilicate glass and fluorinated silica glass, or similar.