Chip decappers of Twitter! If I have a particular IC in one package (e.g. SOIC8) and for whatever reason I really need it to be inside a different, smaller package (e.g. TSSOP8), perhaps with some pins swapped, is it feasible to do a transplant?
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yeah I have never heard of bond wires being soldered. you can't possibly solder them one by one because they'd just keep getting off since the die is small and conductive. i guess in theory you could solder them all simultaneously, though that'd be pretty stupid.
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I mean, consider this: the balls on a WLCSP package are clearly soldered onto the die. that means it is, indeed, possible to wet the pads with solder. just not necessarily practical or meaningful to attempt
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