It's coming together! In other good news... @gabeelikes didn't ruin it yet and it boots. GGWP.https://twitter.com/UplayUbisoft/status/939171489881968641 …
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Also should spread it first.-
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When i saw that i thought to myself do i put too much on? i make a thin Layer across the whole chip.
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BASHIOK SAYS NO.
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IT WAS A LITTLE BIT BIGGER THAN A PIECE OF RICE WHAT DO YOU WANT FROM ME
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Never spread 1st. As you tighten it forces it further out and ends up too thin
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No such thing as "too thin". The purpose is to fill gaps, not create a barrier. 100% contact with no paste would be ideal if possible. Hence heat transfer improvements with lapping and liquid metal.
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