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You've still got to seal it, preferably hermetically; easier to do that with a soldered- or brazed-on lid on a ceramic package than with some two-part plastic thing. In mass production I guess it's basically an overmold over the leadframe.
That's true, but OTOH glob-top chips work in production so... doesn't sound insurmountable?
maybe it's just because it's easier to not surmount it?
Also, wire bonding machine was a fairly common thing to have around in the industry or unis (even to this day), so you may want to pay only for dicing, buy some ceramics from Kyocera and just do it on your site; experiment with different packages/pinouts etc
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