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So the question is, why don't they just... make plastic packages that work the same way? Big hole in the middle for the die to be bonded out of?
I guess by the time you're at those small volumes the cost of a single plastic vs ceramic package isn't usually a concern. Also you don't have to deal with the much worse thermal expansion properties of epoxy vs ceramic when glueing it down etc. (speculation)
i imagine part of it is that a non-bespoke/generic plastic package would likely be far more vulnerable to thermal issues (+ other phys. issues maybe?) than a ceramic one, leading to an unacceptable MTBF compared to the slightly more expensive ceramic package?
(by other physical issues i mean the fact that plastic being considerably more flexible than ceramic would likely cause problems when you get into any sort of mechanical stress, since you're not making a plastic tomb for it but rather making a chill pad for the die to vibe in)
You've still got to seal it, preferably hermetically; easier to do that with a soldered- or brazed-on lid on a ceramic package than with some two-part plastic thing. In mass production I guess it's basically an overmold over the leadframe.
That's true, but OTOH glob-top chips work in production so... doesn't sound insurmountable?
You can do milled out packages where you get some plastic packages with no die inside, mill a hole and expose the leadframe then do die attach, wire bond and glob top, but I've only seen it done where there's no ceramic equivalent package available.
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