Realised again that some of my electronics tinkering followers may not have watched this incredible talk. It fundamentally changed the way I think about power and signals in circuits. "Where is the energy in a PCB? It's in the fiberglass."https://www.altium.com/live-conference/altiumlive-2018-annual-pcb-design-summit/sessions/extreme-importance-pc-board-stack-up …
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(I've yet to watch the video) so like uh... is there an actual serious problem with revC or are you like memeing?
I'm, um, half memeing. I hope our board stackup is F-In1-In2-B (In1=GND plane under top side). That part is important @esden.
It's actually not too bad, but given what I've learned from that video, I'd replace certain areas of the 3V3 In2 plane with more GND plane and add vias.
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yep, In1 is GND plane
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I mean, I hope it's being fabbed in that order.
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looking at revC1 which is what I have lying around here, but I think revC2 didn't materially change the general routing plan?
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Anyway, I think some use cases would probably never pass EMI testing, but I guess we were never going for that (not like we can guarantee it with user logic).
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