The presentation I did at @BSidesLeeds was on code readout protection bypasses. I covered a number of attacks, most of which can be made generic to other devices. Here they are.
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Laser decap seems to be used when you don't want bond wires. Reverse acid fume jet seems to be best way.
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I think the professional laser decap machines are mainly used to remove the bulk of the package and from looking at the videos they preserve bond wires. Maybe
@ControlLaser can provide some insight. - 2 more replies
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