My loss is your gain: had to patch another Fomu. For multiple reasons USB D- wasn't connected (D- pogo pin in wrong location / D- solderball not connected) and so I made another sample to help locate the test jig issue. This time I bypassed an eyepiece to film it - enjoy!
pic.twitter.com/YODk2qtJQx
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Temp definitely impacts UV cure speed too. I’ve noticed much much longer times when in a cold (40-50F) garage. Nice rework! What’s the reason for wire next to & not under? I think there may be some tweaks to simplify the positioning part of this.
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Wire under leaves no space for the solder, so you either get the ball pushing up the CSP causing disconnects, or excess solder shorting to neighboring balls. Putting it next to the ball causes the molten solder to wick onto the wire, away from neighbors & preserving planarity...
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Great, thanks!
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Sometimes I peek into the SMD repair shops and glean a technique or two. Some might even say I stole/copied their trade secrets. 