On one hand, Nintendo fans would probably lose their minds if they only knew that I'm actively buying Nintendo Game & Watch handhelds to ostensibly have their circuit boards hacked apart with a saw and then boiled in nitric acid.
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I would be very interested in reading about the process involved in dumping these.
There's a 243-page(!) forum thread here containing the lion's share of all of the info related to our collective handheld-dumping effort: http://forums.bannister.org//ubbthreads.php?ubb=showflat&Number=97003 … However, as 243 pages is quite a lot, I'll give you a shorter synopsis.
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- Some (many?) of these 4-bit MCUs have undocumented test modes which *can* be used to dump them electrically, if hooked up to a bespoke test jig. - However, it usually requires depackaging (using fuming nitric acid) of an equivalent chip in order to figure out the test mode.
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- This also only really applies if the MCU is in a proper package, versus the silicon die being bonded directly to the PCB and dotted with epoxy. - In these cases, once the silicon die is exposed and cleaned with Whink, it's photographed under a microscope + images stitched.
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