It's very close to "universal" because they can cover almost the entire spectrum (at least in theory) all the way from L3 cache to DRAM to Flash (in theory, their initial research into multi-level NRAM cells built as a function of the pulse might get to flash-level of density).
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Replying to @david_schor @semiDL
Then in theory 3DXP is just as much a universal memory.
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How? They can't meet the JEDEC specs to be a DDR4/5 *drop-in* replacement down to every performance requirement - including latency. NRAM is actually faster.
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Replying to @david_schor @semiDL
That's why I said in theory. Thanks for reading my tweet so carefully.https://www.extremetech.com/computing/233691-phase-change-memory-can-operate-thousands-of-times-faster-than-current-ram …
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Night&day difference. Devil is in the details. 3DXP already starts with an endurance disadvantage requiring lots of research & a lot of money in order to improve. And there are no guarantees. NRAM starts with an endurance advantage. There are currently no known wearout failures.
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The devil here is manufacturability and yield. And we know nothing about those particularly details.
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Replying to @TheKanter @rs_mux and
Manufacturability is more or less identical to a photoresist coating except for the fact that it stays unlike your usual sacrificial layers. For their 16 Gb die, they said they have a lot of spare tiles for redundancy just in case on top of ECC. Only mass production will tell.
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Replying to @david_schor @rs_mux and
Manufacturability refers to the whole chip and all flows. Integration of new materials is often very challenging.
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Replying to @TheKanter @david_schor and
If you mean the containment of CNTs in a cleanroom to prevent contamination, skywater has already shown this to be possible
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Replying to @semiDL @TheKanter and
They said at HC they already manufactured 10s of 1000s of NRAM dies. I'm sure they understand the manufacturing problems involved.
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One could say the same thing of Intel’s 10nm process. The road to high volume isn’t easy, especially when new materials or structures are involved.
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