1000x this. Please take the time to understand things before you outright dismiss them.https://twitter.com/david_schor/status/1043602185999794178 …
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Yes, but no memory manufacturer really discloses that... They've made plenty of test chips.
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Manufacturability is more or less identical to a photoresist coating except for the fact that it stays unlike your usual sacrificial layers. For their 16 Gb die, they said they have a lot of spare tiles for redundancy just in case on top of ECC. Only mass production will tell.
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Manufacturability refers to the whole chip and all flows. Integration of new materials is often very challenging.
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If you mean the containment of CNTs in a cleanroom to prevent contamination, skywater has already shown this to be possible
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They said at HC they already manufactured 10s of 1000s of NRAM dies. I'm sure they understand the manufacturing problems involved.
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One could say the same thing of Intel’s 10nm process. The road to high volume isn’t easy, especially when new materials or structures are involved.
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Very true.
End of conversation
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