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Do you think TSMC or Intel is ahead in terms of 2.5D/3D packaging? Intel has Foveros, EMIB and ODI. TSMC has 3DFabric, InFO and CoWoS. Samsung also has I-Cube4, but I believe that's behind the other two.
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I was wondering why Youtube is deleting your subscribers?? I have watched you on youtube for years. I had not received a bell notification for a long time and when I finally searched it, they had deleted my subscriber status TechTechPotato. What the hell did you know?
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