Greg, indeed. I have a success in predicting Apple Pay and the removal of the 3.5mm headphone jack in 2011.
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Look, I think a ceramic iPhone is a possibility, but *nothing* you have cited goes to the core Q-
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Greg, Apple seems to present air pocket mitigation as important http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PG01&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.html&r=1&f=G&l=50&s1=%2220150217479%22.PGNR.&OS=DN%2F20150217479&RS=DN%2F20150217479 …pic.twitter.com/9UacIITEKL
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Air voids are a manufacturing defect, not a material weakness. This patent mitigates that defect…
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Greg, indeed. Mitigating air pockets strengthens Zirconia based ceramics. The patented CIM process does this.
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No, it does *NOT* strengthen the component. It solves a manufacturing defect.
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Greg, thus by improving the CIM process Apple presents in this patent application, they will increase strength.
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You are conflating a manufacturing defect with a material property improvement…
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Greg, if the manufacturing process introduces air bubble, it weakens the material property.
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I don’t know how to explain this any more clearly, not every CIM component has air bubbles now…
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Greg, great insights sir. However the material scientists at Apple differ.pic.twitter.com/003IyEdS6U
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Jesus christ, this is like speaking to a brick wall.
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