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Yeah tbh I'm not sure which tiles will be on TSMC, but Intel did announce that they would start pursuing TSMC for CPU cores at some point or were at least removing the policy to keep them home.
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It was just a rumor and seems like 320EUs is not the correct EU count, the driver says 6x4x16= 384EUs Also 6+8 id oddly low (low E-cores core count) unless it's not the highest SKU.
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I got the slide between 8-9 months ago but held onto it for a couple of months before talking about it.
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Thanks for the clarification, I believe it now. Maybe they are more confident in the inhouse process node now or TSMC 3nm isn't good enough (or they realized their CPU architecture doesn't fit on something other than inhouse node)
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After Intel's own debacle with their design + node roadmap misaligning, it's safe to assume future IC teams will factor in that they cannot rely on a particular process, thus being node-flexible would be key.
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