psiblerud
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News Intel SI 11/20: if sales boom, "The industry is not ready for this". Already, Intel can't ship enough desktop chipsets. -Otellini
12:46 PM Nov 23rd
from HootSuite
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NEWS TSMC 10/13: Demand for TSV is 300mm. We decided to construct a 300mm line for TSV work. The new line will be in Fab12. -Dr. Sun
12:40 PM Nov 23rd
from HootSuite
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News 11/17/09: Applied Materials will acquire Semitool for ~$364M, advancing in two fast-growing markets: WLP-TSV and Cu Memory
6:56 PM Nov 19th
from HootSuite
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News: “Global semiconductor sales in the third quarter were above expectations,” -Scalise " Q3 sales of $61.9B, a 19.7% increase Q2
9:30 PM Nov 8th
from HootSuite
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News Oct 15: Taiwan's ITRI and Applied Materials to collaboration on development and commercialization of 3D* chip stacking technology.
7:37 PM Oct 15th
from HootSuite
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NEWS: IMEC and TSMC extended their relationship "Innovation Incubation Alliance", focus "more-than-Moore" technology INCLUDING 3D -Oct7
2:45 PM Oct 7th
from HootSuite
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Qualcomm News: The attraction of TSVs is apparent for mobile wireless- low-cost -improve power efficiency -enhancing performance -10/6/09
9:42 AM Oct 6th
from HootSuite
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Qualcomm "If this (TSV) technology adds more than 10% to final costs, it will not be widely used in high-volume wireless technology," -Oct6
9:02 AM Oct 6th
from HootSuite
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IMEC reported that it and its 3D integration partners have taped-out Etna, 3D chip integrating a commercial DRAM chip on top of a logic IC
10:33 AM Oct 1st
from web
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NEWS Sept30,09: Semitool Unveils Raider-S™ for High Volume Through-Silicon-Via (TSV) and Wafer-Level Packaging (WLP) Production.
5:39 AM Sep 30th
from HootSuite
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News Sept09: NEC Electronics and Hitachi and Mitsubishi (Renesas Technologies) have agreed to merge.
11:14 PM Sep 29th
from HootSuite
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Tower Semiconductor & Jazz announced Deep-Silicon-Via(TM)(DSV) technology available in its 0.18-micron SiGe BiCMOS
11:09 PM Sep 29th
from HootSuite
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"PC demand appears be running much stronger than we expected back in June, especially in the US and China," Gartner Sept 29, 09
6:23 PM Sep 25th
from HootSuite
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Congrats T.I. NEWS: TI Philippines projects an "unprecedented" increase in demand for several packaging types. Clark ahead of schedule.
7:40 PM Sep 22nd
from HootSuite
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Elpida 8-Gbit Stacked DRAM using TSV uses only 1/4 the standby power compared with MCP and PoP.
1:09 PM Sep 17th
from HootSuite
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Yole News: TSMC has already started using TSV technology in mass production for Si LED modules
12:10 PM Sep 17th
from HootSuite
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VLSI News: DDR3 DRAM is growing rapidly, it provides power savings as well as speed improvements. by year end should be 20% of DRAM sales
11:38 AM Sep 17th
from HootSuite
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Elpida 8GB-DRAM TSV products-reduce power consumption; applications: Ultra high-density DRAM, DRAM/logic stacks, High-end graphics chips -pg
12:57 PM Sep 14th
from HootSuite
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NEWS: Elpida Memory uses Cu through-silicon via in 8-Gbit DRAM. The company is within sight of mass production of TSV products."
8:30 PM Sep 7th
from web
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As predicted: Advanced Technology Investment Co (Abu Dhabi) acquires Chartered Semiconductor(Singapore). for ~$3.9B -6mo after AMD deal
8:25 PM Sep 7th
from web
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- Name Paul Siblerud
- Location N.W. Montana
- Bio Semiconductor Marketing, too many dogs, too little time and too much Gardening
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