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STATSChipPACLtd

  1. See STATS ChipPAC at ECTC 2012 p0.vresp.com/MdMCnd #vr4smallbiz, booth 213 for the latest wafer level, flip chip, Cu wire & TSV info.
  2. STATS ChipPAC Q1 2012 webcast and earnings call scheduled for 8 a.m. Wednesday, Singapore 4/25/12. bit.ly/K56diP #STATSChipPACLtd
  3. STATS ChipPAC Reports First Quarter 2012 Results bit.ly/Ilk0Vc #STATSChipPACLtd
  4. STATS ChipPAC Appoints semiconductor industry veteran and former STMicroelectronics CEO Pasquale Pistorio as Director bit.ly/I6eV47
  5. Visit our booth at the Common Platform Tech Forum today to discuss 3D pkg solutions. Or visit our virtual booth at bit.ly/AhAd4U
  6. STATS ChipPAC Offers Scalable 3D eWLB-PoP Solutions. Join us at IMAPS DPC 2012 or visit bit.ly/wwCDCV for more info #eWLB_Technology
  7. Join STATS ChipPAC at IMAPS Device Pkg Conf, Mar 5-8, Fountain Hills, AZ Booth 23 #STATSChipPACLtd #eWLB_Technology p0.vresp.com/t5rZVT
  8. STATS ChipPAC announces plan for its Thailand plant. bit.ly/yOo8xA for more information. #STATSChipPACLtd
  9. STATS ChipPAC Ltd releases Q4 and Full Year 2011 earnings. Investor Conference Call / Live Audio Webcast details at bit.ly/xHVx2W
  10. STATS ChipPAC reports Q4 and full year 2011 results. Achieves record revenue for 2011. bit.ly/wUwjVX for more information.
  11. STATS ChipPAC Schedules 4th Quarter and Full Year 2011 Results Conference Call. For details, visit bit.ly/yTOTd1 #STATSChipPACLtd
  12. #STATSChipPACLtd breaks ground for new mfg facility in Singapore to support advanced wafer level technologies. More at bit.ly/w3u4Pp
  13. STATS ChipPAC issues update on Thailand plant affected by Oct floods; affirms Q411 outlook. #STATSChipPACLtd. More at bit.ly/rJbY76
  14. Read Steve Anderson's article, "Innovation Trends Driving WLP & 3D Pkg" in Nov-Dec issue of Chip Scale Review, pp14-17 bit.ly/uFFtbA
  15. #STATSChipPAC completes expansion of 300mm Wafer Bump & #WLCSP operation in Taiwan. bit.ly/sUxpEQ
  16. STATS ChipPAC Reports Third Quarter 2011 Results. #STATSChipPACLtd bit.ly/uU4Mvp
  17. STATS ChipPAC Ltd Schedules Third Quarter 2011 Results Conference Call. Visit bit.ly/sqmaVF for more information. #STATSChipPACLtd
  18. #STATSChipPACLtd announces that floods are affecting its operation in Pathumthani, Thailand. See bit.ly/hzKpy0 for more information.
  19. STATSChipPAC’s next-gen Fan-out Wafer Level Technology #FO-WLP scales packaging solutions for broader range of advanced apps. bit.ly/rbBigV
  20. STATS ChipPAC to feature eWLB & TSV at upcoming events p0.vresp.com/Dm3Ck9 #vr4smallbiz