STATSChipPACLtd
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See STATS ChipPAC at ECTC 2012 , booth 213 for the latest wafer level, flip chip, Cu wire & TSV info.
12:13 PM May 30th
via VerticalResponse
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STATS ChipPAC Q1 2012 webcast and earnings call scheduled for 8 a.m. Wednesday, Singapore 4/25/12.
3:36 AM Apr 24th
via web
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STATS ChipPAC Reports First Quarter 2012 Results
3:34 AM Apr 24th
via web
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STATS ChipPAC Appoints semiconductor industry veteran and former STMicroelectronics CEO Pasquale Pistorio as Director
8:30 AM Apr 23rd
via web
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Visit our booth at the Common Platform Tech Forum today to discuss 3D pkg solutions. Or visit our virtual booth at
9:20 AM Mar 14th
via web
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STATS ChipPAC Offers Scalable 3D eWLB-PoP Solutions. Join us at IMAPS DPC 2012 or visit for more info
6:07 AM Mar 6th
via web
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Join STATS ChipPAC at IMAPS Device Pkg Conf, Mar 5-8, Fountain Hills, AZ Booth 23
8:16 PM Mar 5th
via web
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STATS ChipPAC announces plan for its Thailand plant. for more information.
3:54 PM Jan 31st
via web
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STATS ChipPAC Ltd releases Q4 and Full Year 2011 earnings. Investor Conference Call / Live Audio Webcast details at
3:53 PM Jan 31st
via web
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STATS ChipPAC reports Q4 and full year 2011 results. Achieves record revenue for 2011. for more information.
3:51 PM Jan 31st
via web
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STATS ChipPAC Schedules 4th Quarter and Full Year 2011 Results Conference Call. For details, visit
3:44 PM Jan 30th
via web
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breaks ground for new mfg facility in Singapore to support advanced wafer level technologies. More at
1:56 AM Jan 5th
via web
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STATS ChipPAC issues update on Thailand plant affected by Oct floods; affirms Q411 outlook. . More at
12:34 PM Dec 6th, 2011
via web
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Read Steve Anderson's article, "Innovation Trends Driving WLP & 3D Pkg" in Nov-Dec issue of Chip Scale Review, pp14-17
4:10 PM Dec 1st, 2011
via web
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completes expansion of 300mm Wafer Bump & operation in Taiwan.
9:45 PM Nov 16th, 2011
via web
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STATS ChipPAC Reports Third Quarter 2011 Results.
2:38 AM Oct 28th, 2011
via web
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STATS ChipPAC Ltd Schedules Third Quarter 2011 Results Conference Call. Visit for more information.
11:55 AM Oct 27th, 2011
via web
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announces that floods are affecting its operation in Pathumthani, Thailand. See for more information.
1:28 PM Oct 26th, 2011
via web
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STATSChipPAC’s next-gen Fan-out Wafer Level Technology -WLP scales packaging solutions for broader range of advanced apps. bit.ly/rbBigV
6:55 AM Oct 6th, 2011
via web
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STATS ChipPAC to feature eWLB & TSV at upcoming events
6:26 PM Sep 30th, 2011
via VerticalResponse
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- Name STATS ChipPAC Ltd
- Location Singapore
- Web http://www.statsc...
- Bio Official Twitter site of STATS ChipPAC Ltd, a leading service provider of semiconductor packaging design, assembly and test solutions. eWLB Innovation Leader!
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